TSMC expands advanced chip packaging capacity with two new factories in Taiwan

Taiwan's science minister announced TSMC will add two factories for advanced chip packaging at the Chiayi Science Park, with two existing factories already operating or nearing production.

• Science Minister Wu Cheng-wen announced TSMC will add two new factories for advanced chip packaging at the Chiayi Science Park in southern Taiwan.
• The first packaging factory has entered commercial production; the second is expected to begin production soon, raising the total to four factories upon completion.
• Wu stated the science park is projected to generate annual production value exceeding 300 billion Taiwan dollars ($9.35 billion) and create more than 9,000 jobs.
• The expansion targets growing demand from AI chip designers, including Nvidia, which relies on advanced packaging for its processors.